Integrated circuit card
US5414253A · kind A · utility
31Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1994 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Feb 18, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/077
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit card includes packaged semiconductor devices mounted on a substrate. The integrated circuit card also includes a housing bonded by sheet adhesives to the semiconductor devices or substrate. The housing includes top and bottom metal covers and may include spacers positioned between the sheet adhesives and semiconductor devices or substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.