Three-zone rapid thermal processing system utilizing wafer edge heating means
US5418885A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1992 |
| Grant date | May 23, 1995 |
| Priority date | — |
| Expiry date | Dec 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0047
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A three zone rapid thermal processing system includes three arrays of radiant heating lamps for heating a semiconductor wafer. The arrays are positioned along the axis of the wafer such that one array is adjacent one face of the wafer, the second array is adjacent the second face of the wafer and the third array is adjacent the edge of the wafer. A wafer holder holds the wafer face transverse to the common axis of the radiant heating lamps. Reflectors at each array reflect radiant heat onto the wafer. The arrays are independently connected to power sources and a controller to provide efficient coupling of the heat sources and a uniform temperature distribution across a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.