John R. Hauser
8Patents
7h-index
12Co-inventors
60Inventor score
Filing activity: Nov 22, 1985 → Feb 25, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5418885A | Three-zone rapid thermal processing system utilizing wafer edge heating means | Electricity | 60 | Expired |
| US7721069B2 | Low power, high performance, heterogeneous, scalable processor architecture | Physics | 51 | Expired |
| US4805148A | High impendance-coupled CMOS SRAM for improved single event immunity | Emerging Cross-Sectional Technologies | 51 | Expired |
| US8386751B2 | Low power, high performance, heterogeneous, scalable processor architecture | Physics | 37 | Active |
| US6472233B1 | MOSFET test structure for capacitance-voltage measurements | Electricity | 20 | Expired |
| US5253324A | Conical rapid thermal processing apparatus | Mechanical Engineering; Lighting; Heating | 16 | Expired |
| USH667H | Patterned tunnel junction | General | 12 | Active |
| US8880850B2 | Low power, high performance, heterogeneous, scalable processor architecture | Physics | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.