Electroplating process
US5419829A · kind A · utility
3Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | May 17, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for electroplating a nonconducting surface using a metal oxide colloid. The process comprises contacting the surface of the nonconductor to be plated with a preformed colloid of a metal oxide to adsorb the colloid onto the surface of the nonconductor and then electroplating metal over the surface having the adsorbed metal oxide colloid. The process may include a step of reducing the metal oxide to a lower valent state prior to the step of metal plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.