Wade Sonnenberg
26Patents
11h-index
34Co-inventors
71Inventor score
Filing activity: Aug 23, 1988 → Apr 24, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5252196A | Copper electroplating solutions and processes | Chemistry; Metallurgy | 64 | Expired |
| US5223118A | Method for analyzing organic additives in an electroplating bath | Chemistry; Metallurgy | 42 | Expired |
| US5051154A | Additive for acid-copper electroplating baths to increase throwing power | Electricity | 30 | Expired |
| US6440642B1 | Dielectric composition | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6911068B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 17 | Expired |
| US6827839B2 | Plating bath analysis | Chemistry; Metallurgy | 17 | Expired |
| US5068013A | Electroplating composition and process | Electricity | 17 | Expired |
| US6773573B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 16 | Expired |
| US6652731B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 14 | Expired |
| US4932518A | Method and apparatus for determining throwing power of an electroplating solution | Electricity | 14 | Expired |
| US6899829B2 | Conductive polymer colloidal compositions with selectivity for non-conductive surfaces | Electricity | 12 | Expired |
| US6736954B2 | Plating bath and method for depositing a metal layer on a substrate | Electricity | 11 | Expired |
| US6752878B2 | Process for treating adhesion promoted metal surfaces | Electricity | 10 | Expired |
| US4897165A | Electroplating composition and process for plating through holes in printed circuit boards | Electricity | 10 | Expired |
| US6174647A | Metallization process and component | Electricity | 10 | Expired |
| US5425873A | Electroplating process | Electricity | 9 | Expired |
| US5004525A | Copper electroplating composition | Electricity | 8 | Expired |
| US5667662A | Electroplating process and composition | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6123995A | Method of manufacture of multilayer circuit boards | Electricity | 6 | Expired |
| US7384535B2 | Bath analysis | Physics | 4 | Expired |
| US5419829A | Electroplating process | Electricity | 3 | Expired |
| US6039859A | Method for electroplating using stabilized dispersions of conductive particles | Electricity | 3 | Expired |
| US6017967A | Electroplating process and composition | Chemistry; Metallurgy | 2 | Expired |
| US5800739A | Stabilized dispersions of graphite particles | Electricity | 2 | Expired |
| US5395652A | Plating catalyst formed from noble metal ions and bromide ions | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.