Large scale protrusion membrane for semiconductor devices under test with very high pin counts
US5422574A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 14, 1993 |
| Grant date | Jun 6, 1995 |
| Priority date | — |
| Expiry date | Jan 14, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An embodiment of the present invention is a probe membrane with a center contact bump area and a plurality of signal connection sections separated by triangular reliefs in the membrane and terminating in a tangential row of contacts for wire bonding to a probe card. The system of triangular reliefs in the membrane allows the membrane to be puckered up such that the center contact bump area is raised approximately ninety mils above the general plane of the probe card. When the membrane has been fixed in its puckered up position, the triangular reliefs in the membrane form several radial rectangular slits. A translator gimbal attached to the center of the membrane provides stability and contact force for the contact bumps to a DUT. Areas of transparency in the vicinity of the contact bump area allows a user to view the I/O pads of a DUT for alignment with the contact bumps in the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.