Selective addition of a solder ball to an array of solder balls
US5425493A · kind A · utility
18Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1994 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Aug 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A specially designed tip containing an electron discharge milled cone of specific dimensions is used to transfer a critical solder volume from a solder ball carrier to a specific solder ball site on the base line metal on a high density chip, substrate terminal connection, solder ball connection, or any solder ball array. The critical tip/cone dimensions have a height of the cone and a circumference at the base which generate a specific volume of solder to be transferred.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.