Electroplating process
US5425873A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1994 |
| Grant date | Jun 20, 1995 |
| Priority date | — |
| Expiry date | Apr 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating selectively over the remaining portions of said substrate. The protective film enables selective sulfide formation only on metallic sites without formation of a sulfide coating on metallic surface regions of the substrate which would otherwise interfere with metal-to-metal bond during electroplating. Following formation of the sulfide conversion coating, the protective film is removed and the surface of the substrate electroplated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.