Ultrasonic flip chip process and apparatus
US5427301A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1994 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | May 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for bonding a flip chip (20) to a substrate (22) comprising positioning the flip chip (20) above the substrate (22). The flip chip (20) has an active face provided with conductive bumps so that its active face is oriented toward the substrate (22). The flip chip (20) is placed on the substrate (22) so that the bumps align with a bonding pattern on the substrate (22). An ultrasonic horn (30) is lowered having a flat surface onto a back side of the flip chip (20). Force is applied through the ultrasonic horn (30) to the back side of the flip chip (20), which is normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the force is applied so that the ultrasonic energy is isothermally transferred across the flip chip (20) to the substrate (22) and a diffusion bond is created therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.