Process for corrosion free multi-layer metal conductors
US5427983A · kind A · utility
11Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1992 |
| Grant date | Jun 27, 1995 |
| Priority date | — |
| Expiry date | Dec 29, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin-layer metallization structure in which the final gold layer is deposited by evaporation with the surface onto which it is evaporated maintained at an elevated temperature. By evaporating the uppermost gold layer of the structure at an elevated substrate temperature, the gold atoms have a higher mobility, causing the deposited gold to spread over the edge of the structure and cover the otherwise exposed edges, including the edge at the copper interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.