Sampath Purushothaman
187Patents
37h-index
270Co-inventors
93Inventor score
Filing activity: Sep 5, 1989 → Jan 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7030481B2 | High density chip carrier with integrated passive devices | Electricity | 320 | Expired |
| US7855101B2 | Layer transfer process and functionally enhanced integrated circuits produced thereby | Electricity | 299 | Active |
| US6962872B2 | High density chip carrier with integrated passive devices | Electricity | 298 | Expired |
| US6184121A | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Electricity | 281 | Expired |
| US5470661A | Diamond-like carbon films from a hydrocarbon helium plasma | Emerging Cross-Sectional Technologies | 265 | Expired |
| US8129256B2 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Electricity | 249 | Active |
| US5830332A | Sputter deposition of hydrogenated amorphous carbon film and applications thereof | Physics | 200 | Expired |
| US7045453B2 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Electricity | 199 | Expired |
| US5946551A | Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric | Electricity | 145 | Expired |
| US6413852B1 | Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material | Electricity | 130 | Expired |
| US5582858A | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Emerging Cross-Sectional Technologies | 109 | Expired |
| US7023093B2 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Electricity | 104 | Expired |
| US5981970A | Thin-film field-effect transistor with organic semiconductor requiring low operating voltages | Electricity | 103 | Expired |
| US6224690A | Flip-Chip interconnections using lead-free solders | Electricity | 99 | Expired |
| US6335539B1 | Method for improving performance of organic semiconductors in bottom electrode structure | Electricity | 94 | Expired |
| US5491610A | Electronic package having active means to maintain its operating temperature constant | Emerging Cross-Sectional Technologies | 86 | Expired |
| US6207472A | Low temperature thin film transistor fabrication | Electricity | 86 | Expired |
| US6114413A | Thermally conducting materials and applications for microelectronic packaging | Electricity | 76 | Expired |
| US5436412A | Interconnect structure having improved metallization | Electricity | 75 | Expired |
| US7901977B1 | Data protection by detection of intrusion into electronic assemblies | Emerging Cross-Sectional Technologies | 73 | Expired |
| US6451712B1 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Electricity | 71 | Expired |
| US7037744B2 | Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby | Electricity | 68 | Expired |
| US6337522B1 | Structure employing electrically conductive adhesives | Electricity | 61 | Expired |
| US6344660B1 | Thin-film field-effect transistor with organic semiconductor requiring low operating voltages | Electricity | 60 | Expired |
| US6911400B2 | Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same | Emerging Cross-Sectional Technologies | 58 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.