Method for manufacturing composite lead frame
US5428889A · kind A · utility
8Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1992 |
| Grant date | Jul 4, 1995 |
| Priority date | — |
| Expiry date | Dec 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au--Sn alloy layer. The Au--Sn alloy layer contains Au of 10 to 40 weight %. An inner lead of a metal lead frame is connected to a patterned lead of a flexible lead-patterned substrate by a heating tool. The inner lead is coated on bottom and side surfaces of its tip portion. The bottom surface faces the patterned lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.