Ultrasonic bonding apparatus and quality monitoring method
US5431324A · kind A · utility
32Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1993 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | Jan 22, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.