Method and system for plasma treatment
US5431769A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1993 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | Oct 25, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32688
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma treatment method and system allowing the plasma intensity to be controllably distributed perpendicularly to the inner wall and ensuring effective and uniform treatment in the case of executing plasma cleaning, plasma CVD, RIE or the like. In the plasma treatment where plasma is generated within a chamber 1 for plasma treatment, magnetic field 31 is applied perpendicularly to the inner wall of the chamber to produce plasma whose intensity is directed perpendicularly to the inner wall of the chamber or in parallel with the surface to be treated. Further, the magnetic filed 31 rendered into a revolving field 32 may be applied to rotate the plasma to accomplish a uniform and effective treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.