High power dissipation vertical mounted package for surface mount application
US5432678A · kind A · utility
27Cited by
18References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 1994 |
| Grant date | Jul 11, 1995 |
| Priority date | — |
| Expiry date | May 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting device (170) of a semiconductor integrated circuit (202) allows edge mounting on surface of a printed circuit board (250). The mounting device includes a top portion (150) to provide for cooling and protection of the semiconductor chip while a side portion (140) provides for cooling and positioning on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.