Epoxy molding composition for surface mount applications
US5434199A · kind A · utility
15Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1994 |
| Grant date | Jul 18, 1995 |
| Priority date | — |
| Expiry date | Oct 7, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Epoxy molding compositions for surface mount applications are disclosed. The compositions contain multifunctional epoxy resin and multifunctional hardener along with silicone rubber particles, organofunctional silicone fluid and a high loading of silica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.