Reworkable high density interconnect structure incorporating a release layer
US5434751A · kind A · utility
168Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1994 |
| Grant date | Jul 18, 1995 |
| Priority date | — |
| Expiry date | Apr 11, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.