Integrated circuit having a coplanar solder ball contact array
US5435482A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1994 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Feb 4, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount. Additionally, the planarized solder ball contacts locally compensate individually for warpage of the integrated circuit package by variation in the individual dimensions of dependency of each solder ball below the bottom surface of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.