Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
US5436028A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1992 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Jul 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S209/939
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.