Curing silicon hydride containing materials by exposure to nitrous oxide
US5436029A · kind A · utility
24Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1992 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Dec 21, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a low temperature method of forming silica-containing ceramic coatings on substrates. The method involves applying a coating comprising a silicon hydride containing resin on a substrate and heating the coated substrate under an environment comprising nitrous oxide at a temperature sufficient to convert the resin to the silica-containing ceramic coating. This method is especially valuable for forming protective and dielectric coatings on electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.