Shielded liquid encapsulated semiconductor device and method for making the same
US5436203A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 5, 1994 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Jul 5, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor (30) is shielded from electromagnetic interference by a combination of a reference plane (22) of a circuitized substrate (12) and two different encapsulants. The first encapsulant (38) is an electrically insulative encapsulant which mechanically protects a semiconductor die (32). The first encapsulant is constrained by a dam structure (40) so as not to encapsulate conductive reference pads (18) which are electrically connected to the reference plane by conductive vias (20). A second encapsulant (42) is dispensed over the first encapsulant and is in contact with the reference pads. The second encapsulant is an electrically conductive encapsulant, and is preferably made of a precursor material having the same or similar properties as that of the first encapsulant, but is filled with conductive filler particles to establish electrical conductivity of the encapsulant. Accordingly, the semiconductor die is effectively shielded from both the top and bottom by the electrically conductive encapsulant and the reference plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.