Substrate holding apparatus and a system using the same
US5436693A · kind A · utility
9Cited by
7References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 13, 1993 |
| Grant date | Jul 25, 1995 |
| Priority date | — |
| Expiry date | Sep 13, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25B11/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate holding apparatus includes a pump, serving as a suction source, a conveying chuck for holding a wafer substrate by suction, a connection arrangement, including parallel lines intermediate the connection arrangement, for conneting the pump to the chuck, and a valve arrangement including at least one valve provided in at least one of the parallel lines. By selecting one of the parallel lines by controlling opening/closing of these valves, the conductance of the connection line is adjusted, whereby the optimum suction pressure for the chuck is set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.