Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates
US5438167A · kind A · utility
14Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1993 |
| Grant date | Aug 1, 1995 |
| Priority date | — |
| Expiry date | Oct 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/096
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Ferrimagnetic structures formed of ferrimagnetic vias in a unitized multilayer microcircuit structure that is formed of a plurality of co-fired insulating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.