Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device
US5439161A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1994 |
| Grant date | Aug 8, 1995 |
| Priority date | — |
| Expiry date | Sep 7, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.