Photosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinone
US5441845A · kind A · utility
10Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1994 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Feb 16, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition which is adapted for protecting articles and particularly, electronic parts, therewith comprises a polyimide precursor of the following general formula ##STR1## wherein each X individually represents a tetravalent organic group, each Y individually represents a divalent organic group, R.sup.1, R.sup.2 and R.sup.3 may be the same or different and represent a hydrogen atom or a monovalent organic group having form 1 to 10 carbon atoms, and p, q and m are, respectively, an integer of 1 or over, and a photosensitive diazoquinone compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.