Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation
US5442233A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 10, 1992 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Dec 10, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for a semiconductor IC device has a pair of common elongated leads and first and second groups of slender leads arranged on opposite sides of the common elongated leads and generally extending transverse to the common elongated leads. The common elongated leads have as their integral parts slender leads extending therefrom generally transverse thereto and substantially linear extensions from both ends of the common elongated leads. The linear extensions serve to firmly support a semiconductor chip to be packaged along with parts of the leads. The common elongated leads may further have as their integral parts projections extending from their sides for enhancement of the heat dissipation capability. A semiconductor chip may have bonding pads arranged thereon such that bonding wires and the common elongated leads do not cross each other for electrical connection between the common elongated leads and bonding pads of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.