Bump electrode structure to be coupled to lead wire in semiconductor device
US5442241A · kind A · utility
13Cited by
4References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 22, 1994 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Jul 22, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a semiconductor substrate having an insulating film thereon, a pad electrode provided on the insulating film, first and second bumps disposed on the pad electrode to provide a gap therebetween, and a lead wire coupled to the gap. In the structure, each of the first and second bumps has a straight or mushroom bump structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.