Yasuo Tane
8Patents
4h-index
9Co-inventors
46Inventor score
Filing activity: Jul 22, 1994 → Sep 6, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6208019A | Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein | Electricity | 25 | Expired |
| US5442241A | Bump electrode structure to be coupled to lead wire in semiconductor device | Electricity | 13 | Expired |
| US8691628B2 | Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus | Electricity | 5 | Active |
| US5528077A | Flexible tab semiconductor device | Electricity | 4 | Expired |
| US8276537B2 | Method for manufacturing semiconductor device and semiconductor manufacturing apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US9006029B2 | Method for manufacturing semiconductor devices | Electricity | 0 | Active |
| US8772176B2 | Method for forming an adhesive layer and adhesive composition | Electricity | 0 | Active |
| US8629041B2 | Method for manufacturing semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.