Thin-film structure method of fabrication
US5443713A · kind A · utility
41Cited by
5References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1994 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Nov 8, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1646
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A process for fabricating a thin-film structure using a transparent substrate is disclosed. A first structure, such as a ring, is formed of a dielectric material on a conductive material layer. The conductive material is partially removed, such as within the center of the ring structure. A photoresist material pillar is formed to fill the center of the ring structure, protruding above the ring structure rim. Such structures are useful as mandrel structures in the forming of precision components, such as nozzle plates, mesh ink filter screens, and the like, for ink-jet pens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.