Gregory Hindman
11Patents
7h-index
19Co-inventors
59Inventor score
Filing activity: May 4, 1992 → Sep 29, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5240880A | Ti/TiN/Ti contact metallization | Electricity | 57 | Expired |
| US5317187A | Ti/TiN/Ti contact metallization | Electricity | 50 | Expired |
| US5443713A | Thin-film structure method of fabrication | Performing Operations; Transporting | 41 | Expired |
| US6155674A | Structure to effect adhesion between substrate and ink barrier in ink jet printhead | Performing Operations; Transporting | 17 | Expired |
| US6286939A | Method of treating a metal surface to increase polymer adhesion | Performing Operations; Transporting | 17 | Expired |
| US6209991A | Transition metal carbide films for applications in ink jet printheads | Performing Operations; Transporting | 13 | Expired |
| US5338423A | Method of eliminating metal voiding in a titanium nitride/aluminum processing | Electricity | 13 | Expired |
| US5244831A | Method of doping a polysilicon layer on a semiconductor wafer | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6441838B1 | Method of treating a metal surface to increase polymer adhesion | Performing Operations; Transporting | 5 | Expired |
| US7543917B2 | Integrated circuit and method for manufacturing | Electricity | 1 | Active |
| US7150516B2 | Integrated circuit and method for manufacturing | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.