Multilayer conductive wire for semiconductor device and manufacturing method thereof
US5444186A · kind A · utility
7Cited by
4References
39Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 24, 1992 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Aug 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer conductive wire is formed of a plurality of conductive layers stacked upon each other, and has a slit shaped groove extending in the direction intersecting the direction of stress in at least one conductive layer. With the groove mating with a protrusion in another conductive layer or a protrusion in an insulating film layer, a sliding phenomenon between the layers due to the stress can be restrained, so that a multilayer conductive wire free from destruction due to the sliding phenomenon caused by the stress and without losing conductivity can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.