Printed wiring board and production thereof
US5444189A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1993 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Jun 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.