Wire bond pad arrangement having improved pad density
US5444303A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1994 |
| Grant date | Aug 22, 1995 |
| Priority date | — |
| Expiry date | Aug 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bond pad arrangement (104) has an improved pad density for providing a plurality of wire bond terminations for interconnection with corresponding terminations (604) of an IC chip (302. The wire bond pad arrangement (104) includes a substrate (102) and a plurality of pads (912) disposed on the substrate (102) adjacent to one another to form a row of pads (912). Each of the pads (912) is formed in a trapezoidal shape having short and long sides parallel to one another and substantially perpendicular to a line from a central point of the pad (912) to a central point of the corresponding termination (604) of the IC chip (302). The long sides of adjacent pads (912) are positioned alternately towards and away from the corresponding terminations (604) of the IC chip 302).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.