Purge gas in wafer coating area selection
US5447570A · kind A · utility
58Cited by
10References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1992 |
| Grant date | Sep 5, 1995 |
| Priority date | — |
| Expiry date | Jun 23, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus including a support and purge gas supply prevents edge and backside coating on a wafer in manufacture of integrated circuits. Various enclosure elements and methods are disclosed for containing and directing purge gas, and a CVD system is provided incorporating the elements of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.