Genus, Inc.
🏢 View company profile →68Patents
0Active
68Granted
39Portfolio score
Filing activity: Mar 29, 1983 → Aug 30, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5879459A | Vertically-stacked process reactor and cluster tool system for atomic layer deposition | Chemistry; Metallurgy | 851 | Expired |
| US6200893A | Radical-assisted sequential CVD | Electricity | 577 | Expired |
| US6503330B1 | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition | Chemistry; Metallurgy | 463 | Expired |
| US6540838B2 | Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition | Electricity | 391 | Expired |
| US6174377A | Processing chamber for atomic layer deposition processes | Electricity | 353 | Expired |
| US6451695B2 | Radical-assisted sequential CVD | Electricity | 292 | Expired |
| US4690746A | Interlayer dielectric process | Electricity | 278 | Expired |
| US6451119B2 | Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition | Electricity | 251 | Expired |
| US6475910B1 | Radical-assisted sequential CVD | Electricity | 208 | Expired |
| US6368954B1 | Method of copper interconnect formation using atomic layer copper deposition | Electricity | 199 | Expired |
| US6206972A | Method and apparatus for providing uniform gas delivery to substrates in CVD and PECVD processes | Electricity | 154 | Expired |
| US5222567A | Power assist device for a wheelchair | Emerging Cross-Sectional Technologies | 143 | Expired |
| US5855675A | Multipurpose processing chamber for chemical vapor deposition processes | Electricity | 131 | Expired |
| US6638859B2 | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition | Chemistry; Metallurgy | 117 | Expired |
| US6551399B1 | Fully integrated process for MIM capacitors using atomic layer deposition | Electricity | 93 | Expired |
| US4565157A | Method and apparatus for deposition of tungsten silicides | Chemistry; Metallurgy | 81 | Expired |
| US4629635A | Process for depositing a low resistivity tungsten silicon composite film on a substrate | Emerging Cross-Sectional Technologies | 79 | Expired |
| US5294568A | Method of selective etching native oxide | Emerging Cross-Sectional Technologies | 78 | Expired |
| US6387185B1 | Processing chamber for atomic layer deposition processes | Electricity | 70 | Expired |
| US5501993A | Method of constructing CMOS vertically modulated wells (VMW) by clustered MeV BILLI (buried implanted layer for lateral isolation) implantation | Electricity | 69 | Expired |
| US4550684A | Cooled optical window for semiconductor wafer heating | Chemistry; Metallurgy | 66 | Expired |
| US6602784B2 | Radical-assisted sequential CVD | Electricity | 65 | Expired |
| US5383971A | Differential pressure CVD chuck | Chemistry; Metallurgy | 64 | Expired |
| US5094885A | Differential pressure CVD chuck | Chemistry; Metallurgy | 61 | Expired |
| US5447570A | Purge gas in wafer coating area selection | Electricity | 58 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.