Method for forming a bump on a semiconductor device
US5449108A · kind A · utility
14Cited by
6References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Mar 15, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a bump on a semiconductor device takes advantage of the solderability difference of the solder paste applied to a solder pad in order to form a bump, so that it does not require an etching process. In addition, a pre-test of the semiconductor device can be carried out in a state that the solder pad is united with a BLM layer, so as to prove out semiconductor devices of good quality in advance of finishing the formation of the bump and the semiconductor devices of good quality can be applied with a subsequent process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.