Positive photo-sensitive resin composition comprising a photosensitive polybenzoxazole or a mixture of a polybenzoxazole, an organic solvent soluble polymer and a diazoquinone and/or a dihydropyridine compound
US5449584A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1994 |
| Grant date | Sep 12, 1995 |
| Priority date | — |
| Expiry date | Mar 18, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.