Metal film deposition apparatus and metal film deposition method
US5451261A · kind A · utility
9Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1993 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Sep 1, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.