Electrically programmable interconnect element for integrated circuits
US5451811A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A user-programmable interconnect device includes a first lower electrode comprising a conductive material. A layer of dielectric material is disposed over the top surface of the lower conductor. An antifuse material, such as one or more layers of a dielectric material, amorphous silicon, or combinations of such materials, is located in an aperture in the dielectric material where the interconnect element of the present invention is to be formed. A second, upper electrode of conductive material is formed over the top of the antifuse material. A portion of the upper electrode located immediately above the antifuse material is fabricated as a fuse material. A passivation layer covers the second electrode and may have an aperture located therein at a location immediately above the antifuse and fuse material. Electrical connections to circuitry incorporating the interconnect element of the present invention are made to the lower and upper electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.