Semiconductor device with surface mount package adapted for vertical mounting
US5451815A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1994 |
| Grant date | Sep 19, 1995 |
| Priority date | — |
| Expiry date | Mar 22, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes vertical placement part for mounting the semiconductor device on a surface of a circuit board in a vertical position, and a connection part for making electrical connections between the circuit board and a semiconductor element. A stage is provided on which the semiconductor element is placed. The stage has supporting members causing the semiconductor device to vertically stand on the circuit board. Wiring boards, stacked on a side of the stage on which the semiconductor element is placed, have windows in which the semiconductor element is located. The vertical placement part includes wiring lines extending between edges of the wiring boards facing the circuit board and peripheries of the windows. The wiring lines have ends located in the vicinity of the edges of the wiring boards and have a shape enabling the semiconductor device to be mounted on the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.