Apparatus for selectively applying solder paste to multiple types of printed circuit boards
US5452656A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 1994 |
| Grant date | Sep 26, 1995 |
| Priority date | — |
| Expiry date | May 5, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S209/939
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.