Method of manufacturing I/O terminals on I/O pads
US5454159A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 18, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Feb 18, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To manufacture I/O terminals on I/O pads of an electronic component, the electronic component, together with a transparent alignment component which has a reference feature, is placed in a fixture such that the I/O pads are seen through the alignment component and a first one of the two components has a fixed position in the fixture. Thereafter, a second one of the two components is moved in the fixture until a particular position is reached where the I/O pads are aligned with the reference feature; and at that particular position the second one of the two components is confined. Subsequently, the alignment component is replaced at its particular position in the fixture, as attained by the above steps, with an opaque template which has a hole pattern that matches and aligns with the I/O pads. Then, the template hole pattern as positioned by the replacing step, is used to fabricate the I/O terminals on the I/O pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.