Hermetically sealed pressure sensor and method thereof
US5454270A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Jun 6, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0038
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A differential pressure sensor (10) has a sensor die (16) attached to a stress isolation package base (12) with a bonding glass (27) having a similar coefficient of thermal expansion. The bonding glass, and alternately an aluminum layer, provides a hermetic seal between the stress isolation base and sensor die. Pressure is applied to the sensor die port (24). A plastic housing (14) is attached to the stress isolation base with an adhesive (29). A port (23) in the plastic housing is filled with a silicone gel (22). A second pressure source is transferred by way of the silicone gel to the sensor die. Any hostile chemical entering the via contacts the first surface of the sensor die to assert pressure against a transducer circuit (25) to generate the electrical signals representative of the applied pressure but are isolated from the sensitive interconnects by the hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.