Clem H. Brown
14Patents
13h-index
8Co-inventors
67Inventor score
Filing activity: Jul 29, 1991 → Apr 16, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6949816B2 | Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same | Emerging Cross-Sectional Technologies | 126 | Expired |
| US5454270A | Hermetically sealed pressure sensor and method thereof | Physics | 86 | Expired |
| US5340993A | Optocoupler package wth integral voltage isolation barrier | Electricity | 45 | Expired |
| US5545893A | Optocoupler package and method for making | Electricity | 38 | Expired |
| US5437189A | Dual absolute pressure sensor and method thereof | Electricity | 38 | Expired |
| US6917097B2 | Dual gauge leadframe | Electricity | 37 | Expired |
| US5465626A | Pressure sensor with stress isolation platform hermetically sealed to protect sensor die | Physics | 33 | Expired |
| US6148673A | Differential pressure sensor and method thereof | Electricity | 33 | Expired |
| US5438877A | Pressure sensor package for reducing stress-induced measurement error | Physics | 26 | Expired |
| US7033866B2 | Method for making dual gauge leadframe | Electricity | 22 | Expired |
| US5150438A | Optocoupler apparatus with reflective overcoat | Physics | 16 | Expired |
| US5677245A | Small outline optocoupler package method | Electricity | 15 | Expired |
| US5489800A | Dual channel small outline optocoupler package and method thereof | Electricity | 15 | Expired |
| US7821117B2 | Semiconductor package with mechanical stress isolation of semiconductor die subassembly | Electricity | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.