Semiconductor package with chip redistribution interposer
US5455387A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 18, 1994 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Jul 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.