Coated bonding wires in high lead count packages
US5455745A · kind A · utility
3Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1993 |
| Grant date | Oct 3, 1995 |
| Priority date | — |
| Expiry date | Jul 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.