Inspection method for soldered joints using x-ray imaging and apparatus therefor
US5463667A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1993 |
| Grant date | Oct 31, 1995 |
| Priority date | — |
| Expiry date | Apr 28, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/044
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detec…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.