Semiconductor device package and method of making
US5468910A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1995 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Jan 19, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the supportive substrate (10, 12), over the semiconductor die (16). The protective lid (20) is partially encapsulated with molding compound (28). The protective lid (20) prevents the molding compound (30) from contacting the semiconductor die (16), and associated wirebonded wires (18). A portion (30) of the protective lid (20) remains exposed. Thus, a molded package compatible with current product designs and assembly processes is provided, yet disadvantages caused by molding compound contacting the die (16) and wires (18) are avoided. Furthermore, the exposed protective lid (30) provides superior heat dissipation for the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.