Electronic package assembly and connector for use therewith
US5468996A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1994 |
| Grant date | Nov 21, 1995 |
| Priority date | — |
| Expiry date | Mar 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic package including a base member and associated cover member designed for being positioned together to compress at least two circuitized substrates (e.g., a ceramic substrate and a plurality of flexible substrates) positioned therein. One of the substrates is substantially rigid and is positively positioned in a protected, aligned manner within the base. Additionally, the flexible substrates are precisely aligned and initially secured to the rigid substrate, the invention further using yet another resilient means to act against each of the flexible substrates when the packages are fully assembled. The cover is secured to the base to effect final compression of the internal elements. This package may be positioned on and electrically coupled to another circuitized substrate, e.g., PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.