Benson Chan
52Patents
18h-index
56Co-inventors
87Inventor score
Filing activity: Mar 25, 1994 → Oct 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6386890B1 | Printed circuit board to module mounting and interconnecting structure and method | Electricity | 75 | Expired |
| US7142121B2 | Radio frequency device for tracking goods | Physics | 66 | Expired |
| US6712527B1 | Fiber optic connections and method for using same | Electricity | 57 | Expired |
| US5730620A | Method and apparatus for locating electrical circuit members | Electricity | 47 | Expired |
| US5793618A | Module mounting assembly | Electricity | 47 | Expired |
| US6224396A | Compliant, surface-mountable interposer | Electricity | 43 | Expired |
| US6995322B2 | High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same | Emerging Cross-Sectional Technologies | 43 | Expired |
| US7841741B2 | LED lighting assembly and lamp utilizing same | Electricity | 42 | Active |
| US6508595B1 | Assembly of opto-electronic module with improved heat sink | Electricity | 39 | Expired |
| US5764071A | Method and system for testing an electronic module mounted on a printed circuit board | Electricity | 32 | Expired |
| US6741778B1 | Optical device with chip level precision alignment | Physics | 29 | Expired |
| US6635866B2 | Multi-functional fiber optic coupler | Physics | 28 | Expired |
| US7501839B2 | Interposer and test assembly for testing electronic devices | Electricity | 26 | Active |
| US6679707B1 | Land grid array connector and method for forming the same | Electricity | 26 | Expired |
| US6828514B2 | High speed circuit board and method for fabrication | Emerging Cross-Sectional Technologies | 25 | Expired |
| US6349032B1 | Electronic chip packaging | Electricity | 23 | Expired |
| US7738249B2 | Circuitized substrate with internal cooling structure and electrical assembly utilizing same | Emerging Cross-Sectional Technologies | 23 | Active |
| US5530291A | Electronic package assembly and connector for use therewith | Electricity | 21 | Expired |
| US5468996A | Electronic package assembly and connector for use therewith | Electricity | 18 | Expired |
| US6822875B2 | Assembly of opto-electronic module with improved heat sink | Electricity | 16 | Expired |
| US5785535A | Computer system with surface mount socket | Electricity | 15 | Expired |
| US6545226B2 | Printed wiring board interposer sub-assembly | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7541058B2 | Method of making circuitized substrate with internal optical pathway | Physics | 14 | Active |
| US6015301A | Surface mount socket | Electricity | 14 | Expired |
| US7441709B2 | Electronic card assembly | Physics | 13 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.